Mechanism of liquid Bi penetration along Cu grain boundaries

被引：14

作者：

Joseph, B ^{[1
]}

Barbier, F

Aucouturier, M

机构：

[1] CEA, CEREM, SCECF, F-91191 Gif Sur Yvette, France

[2] C2RMF, CNRS, UMR 171, F-75241 Paris 1, France

来源：

SCRIPTA MATERIALIA | 2000年 / 42卷 / 12期

关键词：

copper; liquid bismuth; grain boundaries; penetration;

D O I：

10.1016/S1359-6462(00)00351-1

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A mechanism of liquid metal penetration is proposed for the Cu-Bi couple. Based on a thermodynamic approach, it is shown that an amorphous metastable layer may be formed at Cu grain boundaries.

引用

页码：1151 / 1158

页数：8

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