Mechanism of liquid Bi penetration along Cu grain boundaries

被引：14
|
作者：
Joseph, B [1 ]
Barbier, F
Aucouturier, M
机构：
[1] CEA, CEREM, SCECF, F-91191 Gif Sur Yvette, France
[2] C2RMF, CNRS, UMR 171, F-75241 Paris 1, France
来源：
SCRIPTA MATERIALIA | 2000年 / 42卷 / 12期
关键词：
copper; liquid bismuth; grain boundaries; penetration;
D O I：
10.1016/S1359-6462(00)00351-1
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
A mechanism of liquid metal penetration is proposed for the Cu-Bi couple. Based on a thermodynamic approach, it is shown that an amorphous metastable layer may be formed at Cu grain boundaries.
引用
收藏
页码：1151 / 1158
页数：8
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