MEMS technology - Evaluating the use of hard-mask films during bulk silicon etching

被引:0
|
作者
Goldman, K [1 ]
Sooriakumar, K
Ray, C
Schade, M
机构
[1] Motorola Inc, Micromachining Dev Grp, Sensor Prod Div, Phoenix, AZ 85008 USA
[2] Motorola Inc, Chem & Surface Anal Lab, Phoenix, AZ USA
来源
MICRO | 1997年 / 15卷 / 03期
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:67 / +
页数:5
相关论文
共 50 条
  • [21] ProTEK PSB coating as an alternative polymeric protection mask for KOH bulk etching of silicon
    Rosminazuin Ab Rahim
    Badariah Bais
    Burhanuddin Yeop Majlis
    Gandi Sugandi
    Microsystem Technologies, 2013, 19 : 905 - 914
  • [22] ProTEK PSB coating as an alternative polymeric protection mask for KOH bulk etching of silicon
    Ab Rahim, Rosminazuin
    Bais, Badariah
    Majlis, Burhanuddin Yeop
    Sugandi, Gandi
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (06): : 905 - 914
  • [23] Characterization of TiOx Thin Films Fabricated by Plasma-Enhanced Chemical Vapor Deposition for Hard-Mask Applications in Semiconductor Devices
    Ban, Wonjin
    Kwon, Sungyool
    Nam, Jaehyun
    Kim, Boram
    Jang, Seonhee
    Jung, Donggeun
    SCIENCE OF ADVANCED MATERIALS, 2018, 10 (07) : 923 - 929
  • [24] Application of bulk silicon carbide technology in high temperature MEMS sensors
    Zhai, Yanxin
    Li, Haiwang
    Wu, Hanxiao
    Tao, Zhi
    Xu, Guoqiang
    Cao, Xiaoda
    Xu, Tiantong
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2024, 173
  • [25] Mask charging and profile evolution during chlorine plasma etching of silicon
    Bogart, KHA
    Klemens, FP
    Malyshev, MV
    Colonell, JI
    Donnelly, VM
    Lee, JTC
    Lane, JM
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2000, 18 (01): : 197 - 206
  • [26] Silicon nanoprofiling with the use of a solid aluminum oxide mask and combined "dry" etching
    Belov, A. N.
    Demidov, Yu. A.
    Putrya, M. G.
    Golishnikov, A. A.
    Vasilyev, A. A.
    SEMICONDUCTORS, 2009, 43 (13) : 1660 - 1662
  • [27] Silicon nanoprofiling with the use of a solid aluminum oxide mask and combined “dry” etching
    A. N. Belov
    Yu. A. Demidov
    M. G. Putrya
    A. A. Golishnikov
    A. A. Vasilyev
    Semiconductors, 2009, 43 : 1660 - 1662
  • [28] Robust Cu dual damascene interconnects with porous SiOCH films fabricated by low-damage multi-hard-mask etching technology
    Ohtake, Hiroto
    Tagami, Masayoshi
    Tada, Munehiro
    Ueki, Makoto
    Abe, Mari
    Saito, Shinobu
    Ito, Fuminori
    Hayashi, Yoshihiro
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2006, 19 (04) : 455 - 464
  • [29] Bulk micromachining technology for fabrication of two-level MEMS in standard silicon substrate
    Sarajlic, E
    de Boer, MJ
    Jansen, HV
    Arnal, N
    Puech, M
    Krijnen, G
    Elwenspoek, M
    Transducers '05, Digest of Technical Papers, Vols 1 and 2, 2005, : 1404 - 1405
  • [30] Use of Spin-On-Hard Mask Materials for nano scale patterning technology
    Wu, Wen-Hao
    Chang, Edward Y.
    Cheon, Hwan-Sung
    Kim, Sang Kyun
    Cho, Hyeon Mo
    Yoon, Kyong-Ho
    Kim, Jong Seob
    Chang, Tuwon
    Shin, Seongho
    LITHOGRAPHY ASIA 2008, 2008, 7140