An Accurate Method for Thermal Conductivity Measurement of Thermally Conductive Adhesives

被引：0
|
作者：
Platek, Bartosz [1 ]
Falat, Tomasz [1 ]
Felba, Jan [1 ]
机构：
[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50370 Wroclaw, Poland
来源：
2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY | 2011年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the following paper the measurement method of thermal conductivity is described. These method was especially designed for measuring the thermal conductivity of the thermally conductive adhesives. The principal information about the experimental setup, mathematical model of experiment and the change of its uncertainty (calculated using type B method presented in ISO Guide for measurements) depended on measurement parameters are described. The obtained uncertainty from the model was compared with the real measurements of polymer composites filled with silver microflakes.
引用
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页码：313 / 319
页数：7
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