FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

被引：0
|
作者：
Nabiollahi, Nabi [1 ]
Liu, Johan [1 ]
Zhu Hilli [1 ]
Zhang, Yan [2 ,3 ]
Cong, Yue [2 ,3 ]
Cheng, Zhaonian [2 ,3 ]
Inoue, Masahiro [4 ]
机构：
[1] Chalmers, Dept Microtechnol & Nanosci, Bionano Sci Lab, S-41296 Gothenburg, Sweden
[2] Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Appl, Shanghai 200041, Peoples R China
[3] Shanghai Univ, SMIT Ctr, Sch Mechatron Engn & Automat, Shanghai 200041, Peoples R China
[4] Osaka Univ, Inst Sci & Ind Res, Suita, Osaka 565, Japan
来源：
2009 9TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) | 2009年
基金：
瑞典研究理事会; 美国国家科学基金会;
关键词：
Cubic Cell Method; Finite Elemement Analysis; FEM; Thermal conductvity simulation; Thermally conductive adhesive; TCA; Trimodal; bimodal;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
引用
收藏
页码：422 / 425
页数：4
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