Machine Learning Approaches Optimizing Semiconductor Manufacturing Processes

被引：4
|
作者：
Moriya, Tsuyoshi [1 ]
机构：
[1] Tokyo Electron Ltd, Tokyo, Japan
来源：
2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM) | 2021年
关键词：
Machine learning; plasma processing; materials informatics;
D O I：
10.1109/EDTM50988.2021.9420955
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study was geared toward the optimization of semiconductor manufacturing processes through machine learning (ML) based on a regression algorithm. The nonuniformity of plasma-enhanced atomic layer deposition (PEALD) film thickness and PEALD film stress and the film thickness and carbon etching profiles were demonstrated herein to successfully achieve their targets.
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页数：3
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