Machine Learning Approaches Optimizing Semiconductor Manufacturing Processes

被引：4

作者：

Moriya, Tsuyoshi ^{[1
]}

机构：

[1] Tokyo Electron Ltd, Tokyo, Japan

来源：

2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM) | 2021年

关键词：

Machine learning; plasma processing; materials informatics;

D O I：

10.1109/EDTM50988.2021.9420955

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study was geared toward the optimization of semiconductor manufacturing processes through machine learning (ML) based on a regression algorithm. The nonuniformity of plasma-enhanced atomic layer deposition (PEALD) film thickness and PEALD film stress and the film thickness and carbon etching profiles were demonstrated herein to successfully achieve their targets.

引用

页数：3

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