Improvement in electrostatic effeciency using workfunction modulated dual metal gate FinFET

被引:7
|
作者
Daga, Mitali [1 ]
Mishra, Guru Prasad [1 ]
机构
[1] Natl Inst Technol Raipur, Dept Elect & Commun, Raipur, Madhya Pradesh, India
关键词
Mole fraction; Dual-metal; Subthreshold; Convergence; Electrrostatic efficiency; Scalability; WORK-FUNCTION MODULATION;
D O I
10.1016/j.matpr.2020.09.082
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper demonstrates a 3-D simulation study of a workfunction modulated dual material gate FinFET (WMDMGF). The source side gate material workfunction of a dual material gate FinFET is modulated linearly keeping drain side material workfunction to be constant. This model provides improvement in terms of DC performance such as better drive current and minimum threshold voltage. Thus, enhancing the switching characteristics of the device and providing better speed. The model is simulated using Silvaco TCAD tool, and the results are compared with single metal gate and dual metal gate FinFET performance. ? 2020 Elsevier Ltd. All rights reserved. Selection and peer-review under responsibility of the scientific committee of the International Conference on Nanoelectronics, Nanophotonics, Nanomaterials, Nanobioscience & Nanotechnology.
引用
收藏
页码:3443 / 3446
页数:4
相关论文
共 50 条
  • [31] Dual metal gate FinFET integration by Ta/Mo diffusion technology for Vt reduction and multi-Vt CMOS application
    Matsukawa, Takashi
    Endo, Kazuhiko
    Liu, Yongxun
    O'uchi, Shinichi
    Ishikawa, Yuki
    Yamauchi, Hiromi
    Tsukada, Junichi
    Ishii, Kenichi
    Sakamoto, Kunihiro
    Suzuki, Eiichi
    Masahara, Meishoku
    SOLID-STATE ELECTRONICS, 2009, 53 (07) : 701 - 705
  • [32] Dual Metal Gate FinFET Integration by Ta/Mo Diffusion Technology for Vt Reduction and Multi-Vt CMOS Application
    Matsukawa, Takashi
    Endo, Kazuhiko
    Liu, Yongxun
    O'uchi, Shin-ichi
    Masahara, Melshoku
    Ishikawa, Yuki
    Yamauchl, Hiromi
    Tsukada, Junichl
    Ishii, Ken-ichi
    Sakamoto, Kunihiro
    Suzuki, Eiichi
    ESSDERC 2008: PROCEEDINGS OF THE 38TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, 2008, : 282 - 285
  • [33] Improvement in DC and pulse characteristics of AlGaN/GaN HEMT by employing dual metal gate structure
    Visvkarma, Ajay Kumar
    Laishram, Robert
    Kapoor, Sonalee
    Rawal, D. S.
    Vinayak, Seema
    Saxena, Manoj
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2019, 34 (10)
  • [34] Improvement of Subthreshold Characteristic of Gate-Recessed AlGaN/GaN Transistors by Using Dual-Gate Structure
    Yang, Ling
    Mi, Minhan
    Hou, Bin
    Zhu, Jiejie
    Zhang, Meng
    He, Yunlong
    Lu, Yang
    Zhu, Qing
    Zhou, Xiaowei
    Lv, Ling
    Cao, Yanrong
    Ma, Xiaohua
    Hao, Yue
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (10) : 4057 - 4064
  • [35] Sensitivity Enhancement of Dual Gate FET Based Biosensor Using Modulated Dielectric for Covid Detection
    Saurabh Kumar
    R.K. Chauhan
    Manish Kumar
    Silicon, 2022, 14 : 11453 - 11462
  • [36] Sensitivity Enhancement of Dual Gate FET Based Biosensor Using Modulated Dielectric for Covid Detection
    Kumar, Saurabh
    Chauhan, R. K.
    Kumar, Manish
    SILICON, 2022, 14 (17) : 11453 - 11462
  • [37] Performance Improvement of Double-Gate TFET Using Metal Strip Technique
    Satyendra Kumar
    Kaushal Nigam
    Saurabh Chaturvedi
    Areeb Inshad Khan
    Ashika Jain
    Silicon, 2022, 14 : 1759 - 1766
  • [38] Mobility improvement in CVD graphene by using local metal side-gate
    Acharya, Sanchar
    Babu, Anakha, V
    Khadar, R. Abdul
    Kottantharayil, Anil
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2020, 35 (04)
  • [39] Performance Improvement of Double-Gate TFET Using Metal Strip Technique
    Kumar, Satyendra
    Nigam, Kaushal
    Chaturvedi, Saurabh
    Khan, Areeb Inshad
    Jain, Ashika
    SILICON, 2022, 14 (04) : 1759 - 1766
  • [40] Trap-Induced Data-Retention-Time Degradation of DRAM and Improvement Using Dual Work-Function Metal Gate
    Kim, Kyoung Yeon
    Min, Kyung Kyu
    Park, Byung-Gook
    IEEE ELECTRON DEVICE LETTERS, 2021, 42 (01) : 38 - 41