Reversible wafer bonding for reliable compound semiconductor processing

被引：0

作者：

Dragoi, V ^{[1
]}

Glinsner, T ^{[1
]}

Mittendorfer, G ^{[1
]}

Wimplinger, M ^{[1
]}

Lindner, P ^{[1
]}

机构：

[1] E Thallner GMBH, EV Grp, A-4780 St Florian, Austria

来源：

CAS: 2002 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2001年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Reversible wafer bonding is a process enabling reliable compound semiconductor wafer handling for multi-step processes including photolithography, thinning, etching or coating. Two processes using. wax and dry film-adhesives are presented in this paper.

引用

页码：331 / 334

页数：4

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