Reversible wafer bonding for reliable compound semiconductor processing

被引：0
|
作者：
Dragoi, V [1 ]
Glinsner, T [1 ]
Mittendorfer, G [1 ]
Wimplinger, M [1 ]
Lindner, P [1 ]
机构：
[1] E Thallner GMBH, EV Grp, A-4780 St Florian, Austria
来源：
CAS: 2002 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2001年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Reversible wafer bonding is a process enabling reliable compound semiconductor wafer handling for multi-step processes including photolithography, thinning, etching or coating. Two processes using. wax and dry film-adhesives are presented in this paper.
引用
收藏
页码：331 / 334
页数：4
相关论文
共 50 条
  • [31] Semiconductor Wafer Bonding for Solar Cell Applications: A Review
    Tanabe, Katsuaki
    ADVANCED ENERGY AND SUSTAINABILITY RESEARCH, 2023, 4 (11):
  • [32] Wafer bonding of compound semiconductors using atomic hydrogen
    Akatsu, T
    Plössl, A
    Stenzel, H
    Gösele, U
    SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS V, PROCEEDINGS, 2001, 99 (35): : 60 - 67
  • [33] Polishing and purification processes in semiconductor wafer processing
    Bellmann, C
    Zeidler, D
    TENSIDE SURFACTANTS DETERGENTS, 2002, 39 (06) : 206 - 210
  • [34] The use of segregated hydrofluoroethers in semiconductor wafer processing
    Clark, Philip G.
    Zazzera, Lawrence A.
    2006 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, 2006, : 296 - +
  • [35] A WAFER DESIGN PROBLEM IN SEMICONDUCTOR MANUFACTURING FOR RELIABLE CUSTOMER SERVICE
    SINGH, MR
    ABRAHAM, CT
    AKELLA, R
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (01): : 103 - 108
  • [36] Ferroelectric-semiconductor heterostructures obtained by direct wafer bonding
    Alexe, M
    Kastner, G
    Hesse, D
    Gosele, U
    APPLIED PHYSICS LETTERS, 1997, 70 (25) : 3416 - 3418
  • [37] Transfer of semiconductor and oxide films by wafer bonding and layer cutting
    Qin-Yi Tong
    Li-Juan Huang
    Ulich M. Gösele
    Journal of Electronic Materials, 2000, 29 : 928 - 933
  • [38] Transfer of semiconductor and oxide films by wafer bonding and layer cutting
    Tong, QY
    Huang, LJ
    Gösele, UM
    JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (07) : 928 - 932
  • [39] Reliable adhesive bonding: Processing of paper and cardboard
    Sicheres Kleben: Verarbeitung von Papier und Karton
    1600, Deutscher Fachverlag GmbH, Mainzer Landstrasse 251, Frankfurt a. M., 60326, Germany (145):
  • [40] Hermetic wafer bonding based on rapid thermal processing
    Chiao, M
    Lin, LW
    SENSORS AND ACTUATORS A-PHYSICAL, 2001, 91 (03) : 398 - 402
12345