Thickness mapping of thin dielectrics with emission microscopy and conductive atomic force microscopy for assessment of dielectrics reliability

被引:0
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作者
Ebersberger, B [1 ]
Benzinger, G [1 ]
机构
[1] SIEMENS AG,SEMICOND DIV,D-81739 MUNICH,GERMANY
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:126 / 130
页数:3
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