Thickness mapping of thin dielectrics with emission microscopy and conductive atomic force microscopy for assessment of dielectrics reliability

被引：0
|
作者：
Ebersberger, B [1 ]
Benzinger, G [1 ]
机构：
[1] SIEMENS AG,SEMICOND DIV,D-81739 MUNICH,GERMANY
来源：
1996 IEEE INTERNATIONAL RELIABILITY PHYSICS PROCEEDINGS, 34TH ANNUAL | 1996年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：126 / 130
页数：3
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