A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures

被引：9

作者：

Yang, Hyung Suk ^{[1
]}

Zhang, Chaoqi ^{[1
]}

Bakir, Muhannad S. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 03期

关键词：

Flip chip; interconnections; microsystems packaging;

D O I：

10.1109/TCPMT.2015.2467318

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 mu m (five times the radius of solder balls used) of initial misalignment during flip-chip assembly. Critical components of the self-alignment are four polymeric positive self-alignment structures (PSASs), which are fabricated on a substrate, and four inverted pyramid pits, which are etched on a silicon chip in corresponding positions. The PSAS is removed using solvent after the assembly. Resistance of the solder joints is measured to be below 9 m Omega

引用

页码：471 / 477

页数：7

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