A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures

被引：9
|
作者：
Yang, Hyung Suk [1 ]
Zhang, Chaoqi [1 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 03期
关键词：
Flip chip; interconnections; microsystems packaging;
D O I：
10.1109/TCPMT.2015.2467318
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 mu m (five times the radius of solder balls used) of initial misalignment during flip-chip assembly. Critical components of the self-alignment are four polymeric positive self-alignment structures (PSASs), which are fabricated on a substrate, and four inverted pyramid pits, which are etched on a silicon chip in corresponding positions. The PSAS is removed using solvent after the assembly. Resistance of the solder joints is measured to be below 9 m Omega
引用
收藏
页码：471 / 477
页数：7
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