共 50 条
- [1] Plating of 60/40 tin/lead solder for head termination metallurgy PLATING AND SURFACE FINISHING, 1997, 84 (01): : 38 - 40
- [2] MECHANICAL BEHAVIORS OF 60/40 TIN LEAD SOLDER LAP JOINTS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 459 - 468
- [5] Energy approach to the fatigue of 60/40 solder: Part I - influence of temperature and cycle frequency Journal of Electronic Packaging, Transactions of the ASME, 1995, 117 (02): : 130 - 135
- [6] Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder Journal of Electronic Materials, 1998, 27 : 1223 - 1228
- [7] Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder J Electron Mater, 11 (1223-1228):
- [9] Investigation of the Solder Joint Fatigue Life in Combined Vibration and Thermal Cycling Tests 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1209 - 1216
- [10] EFFECT OF CURRENT ON FATIGUE LIFE OF 60SN-40PB SOLDER SCRIPTA METALLURGICA ET MATERIALIA, 1992, 26 (06): : 999 - 1000