共 50 条
- [1] Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder Journal of Electronic Materials, 1998, 27 : 1223 - 1228
- [5] Forming solder joints by sintering eutectic tin-lead solder paste Journal of Electronic Materials, 1999, 28 : 912 - 915
- [8] Electromigration in eutectic tin-lead solder lines at the device temperature 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 160 - 163
- [10] Thermomigration in eutectic tin-lead flip chip solder joints EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 565 - 569