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- [48] Effects of aging temperature on fatigue life of Sn3.0Ag-O.5Cu solder joints 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 421 - 425
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- [50] Experimental and numerical investigation of fatigue damage development under multiaxial loads in a lead-free Sn-based solder alloy 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2016,