Grain boundary mobility of siderophile elements in MgO

被引：1
|
作者：
Hayden, L. A. [1 ]
Watson, E. B. [1 ]
机构：
[1] Rensselaer Polytech Inst, Dept Earth & Environm Sci, Troy, NY 12181 USA
来源：
GEOCHIMICA ET COSMOCHIMICA ACTA | 2006年 / 70卷 / 18期
关键词：
D O I：
10.1016/j.gca.2006.06.480
中图分类号：
P3 [地球物理学]; P59 [地球化学];
学科分类号：
0708 ; 070902 ;
摘要：
引用
收藏
页码：A238 / A238
页数：1
相关论文
共 50 条
  • [41] Grain boundary mobility during recrystallization of copper
    Naval Research Lab, Washington, United States
    Metall Mat Trans A Phys Metall Mat Sci, 3 A (749-754):
  • [42] The effect of solute elements on grain boundary mobility during recrystallization of single-phase aluminium alloys
    Huang, Y
    Humphreys, FJ
    RECRYSTALLIZATION AND GRAIN GROWTH, VOLS 1 AND 2, 2001, : 409 - 414
  • [43] The dual role of hydrogen in grain boundary mobility
    Ding, Yu
    Zhao, Kai
    Lin, Meichao
    Yu, Haiyang
    Xiao, Senbo
    He, Jianying
    Zhang, Zhiliang
    JOURNAL OF APPLIED PHYSICS, 2023, 133 (04)
  • [44] GRAIN-BOUNDARY STRUCTURE AND ITS MOBILITY
    ISHIDA, Y
    TETSU TO HAGANE-JOURNAL OF THE IRON AND STEEL INSTITUTE OF JAPAN, 1984, 70 (15): : 1819 - 1827
  • [45] Grain boundary mobility during recrystallization of copper
    R. A. Vandermeer
    D. Juul Jensen
    E. Woldt
    Metallurgical and Materials Transactions A, 1997, 28 : 749 - 754
  • [46] Atomistic simulations of grain and interphase boundary mobility
    Hoyt, J. J.
    MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2014, 22 (03)
  • [47] Grain boundary mobility during recrystallization of copper
    Vandermeer, R.A.
    Jensen, D. Juul
    Woldt, E.
    Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 1997, 28 (13): : 749 - 754
  • [48] Grain boundary mobility during recrystallization of copper
    Vandermeer, RA
    Jensen, DJ
    Woldt, E
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1997, 28 (3A): : 749 - 754
  • [49] The dual role of hydrogen in grain boundary mobility
    Ding, Yu
    Zhao, Kai
    Lin, Meichao
    Yu, Haiyang
    Xiao, Senbo
    He, Jianying
    Zhang, Zhiliang
    Journal of Applied Physics, 2023, 133 (04):
  • [50] Grain boundary mobility during recrystallization of copper
    Vandermeer, R.A.
    Jensen, D. Juul
    Woldt, E.
    Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 1997, 28 (03): : 749 - 754
12345