Grain boundary mobility during recrystallization of copper

被引：0
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作者：
Vandermeer, R.A. [1 ]
Jensen, D. Juul [2 ]
Woldt, E. [3 ]
机构：
[1] the Physical Metallurgy Branch, Naval Research Laboratory, Washington,DC,20375-5343, United States
[2] the Materials Department, Risø National Laboratory, Roskilde,DK-4000, Denmark
[3] the Institut fÜr Werkstoffe, Technische Universität Braunschweig, Braunschweig,D-38106, Germany
来源：
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 1997年 / 28卷 / 03期
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页码：749 / 754
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