A New Release Control Policy (WRELM) For Semiconductor Wafer Fabrication Facilities

被引：0

作者：

Chen, Z. B. ^{[1
]}

Pan, X. W. ^{[1
]}

Li, L. ^{[1
]}

Chen, Q. J. ^{[1
]}

Xu, W. S. ^{[1
]}

机构：

[1] Tongji Univ, Sch Elect & Informat Engn, Shanghai 201804, Peoples R China

来源：

2014 IEEE 11TH INTERNATIONAL CONFERENCE ON NETWORKING, SENSING AND CONTROL (ICNSC) | 2014年

基金：

中国国家自然科学基金;

关键词：

release control; semiconductor manufacturing; workload regulating; extreme learning machine; dynamic critical value;

D O I：

暂无

中图分类号：

C93 [管理学]; O22 [运筹学];

学科分类号：

070105 ; 12 ; 1201 ; 1202 ; 120202 ;

摘要：

Release control plays an important role on the performance of a semiconductor wafer fabrication facility. Comparing to common release control strategies (such as FIFO, EDD, SA, CONWIP, WR, and WIPCTRL), a new workload regulating policy (abbreviated as WRELM), with a dynamic critical value on the bottleneck obtained by an extreme learning machine, is proposed. WRELM is validated and verified by a simulation model from a real 6 inch fab. The simulation results show that WRELM improves the throughput by 4.02% and decrease the mean cycle time by 15.40% comparing to those of common WR.

引用

页码：64 / 68

页数：5

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