A New Release Control Policy (WRELM) For Semiconductor Wafer Fabrication Facilities

被引：0
|
作者：
Chen, Z. B. [1 ]
Pan, X. W. [1 ]
Li, L. [1 ]
Chen, Q. J. [1 ]
Xu, W. S. [1 ]
机构：
[1] Tongji Univ, Sch Elect & Informat Engn, Shanghai 201804, Peoples R China
来源：
2014 IEEE 11TH INTERNATIONAL CONFERENCE ON NETWORKING, SENSING AND CONTROL (ICNSC) | 2014年
基金：
中国国家自然科学基金;
关键词：
release control; semiconductor manufacturing; workload regulating; extreme learning machine; dynamic critical value;
D O I：
暂无
中图分类号：
C93 [管理学]; O22 [运筹学];
学科分类号：
070105 ; 12 ; 1201 ; 1202 ; 120202 ;
摘要：
Release control plays an important role on the performance of a semiconductor wafer fabrication facility. Comparing to common release control strategies (such as FIFO, EDD, SA, CONWIP, WR, and WIPCTRL), a new workload regulating policy (abbreviated as WRELM), with a dynamic critical value on the bottleneck obtained by an extreme learning machine, is proposed. WRELM is validated and verified by a simulation model from a real 6 inch fab. The simulation results show that WRELM improves the throughput by 4.02% and decrease the mean cycle time by 15.40% comparing to those of common WR.
引用
收藏
页码：64 / 68
页数：5
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