The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

被引：28
|
作者：
Chiu, Tsung-Chieh [1 ]
Lin, Kwang-Lung [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
SCRIPTA MATERIALIA | 2009年 / 60卷 / 12期
关键词：
Electromigration; Intermetallic compounds; Whiskers; Transmission electron microscopy (TEM); Dislocation; TIN; PB;
D O I：
10.1016/j.scriptamat.2009.02.061
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：1121 / 1124
页数：4
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