The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint

被引：28
|
作者：
Chiu, Tsung-Chieh [1 ]
Lin, Kwang-Lung [1 ]
机构：
[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
SCRIPTA MATERIALIA | 2009年 / 60卷 / 12期
关键词：
Electromigration; Intermetallic compounds; Whiskers; Transmission electron microscopy (TEM); Dislocation; TIN; PB;
D O I：
10.1016/j.scriptamat.2009.02.061
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Electromigration through a Cu/Sn3.5Ag/Au solder joint results in rotation of the intermetallic compounds (IMCs). The Sn whiskers induced within the unreacted solder are believed to be due to the mechanical stress induced by this IMC rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicate that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggests that whisker growth experiences turbulence. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：1121 / 1124
页数：4
相关论文
共 50 条
  • [21] Effect of in addition on Sn-3.5Ag solder and joint with Cu substrate
    Choi, WK
    Yoon, SW
    Lee, HM
    MATERIALS TRANSACTIONS, 2001, 42 (05) : 783 - 789
  • [22] The evolution of interfacial microstructure of Sn3.5Ag solder bump with Cu under-bump metallization
    Bi, Jinglin
    Hu, Anmin
    Li, Ming
    Mao, Dali
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 369 - 373
  • [23] Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-PUBMs
    Jeon, YD
    Ostmann, A
    Reichl, H
    Paik, KW
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1203 - 1208
  • [24] Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration
    Lin, Y. X.
    Wang, J. Y.
    Chen, C. Y.
    Wu, C. Y.
    Chiu, C. Y.
    Lee, C. H.
    Yeh, C. Y.
    Huang, B. R.
    Chang, J. S.
    Yen, T. H.
    Fu, K. L.
    Liu, C. Y.
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (12) : 6584 - 6589
  • [25] Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint
    Wang, Fengjiang
    Zhou, Lili
    Zhang, Zhijie
    Wang, Jiheng
    Wang, Xiaojing
    Wu, Mingfang
    JOURNAL OF ELECTRONIC MATERIALS, 2017, 46 (10) : 6204 - 6213
  • [26] Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint
    Fengjiang Wang
    Lili Zhou
    Zhijie Zhang
    Jiheng Wang
    Xiaojing Wang
    Mingfang Wu
    Journal of Electronic Materials, 2017, 46 : 6204 - 6213
  • [27] Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration
    Y. X. Lin
    J. Y. Wang
    C. Y. Chen
    C. Y. Wu
    C. Y. Chiu
    C. H. Lee
    C. Y. Yeh
    B. R. Huang
    J. S. Chang
    T. H. Yen
    K. L. Fu
    C. Y. Liu
    Journal of Electronic Materials, 2021, 50 : 6584 - 6589
  • [28] Effects of Electromigration on the Creep of Sn0.3Ag0.7Cu Solder Joint
    Zuo, Yong
    Ma, Limin
    Guo, Fu
    Qiao, Lei
    Shu, Yutian
    Han, Jing
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 898 - 901
  • [29] Electromigration in Sn3.0Ag0.5Cu flip chip solder joint
    Lu Yu-Dong
    He Xiao-Qi
    En Yun-Fei
    Wang Xin
    Zhuang Zhi-Qiang
    ACTA PHYSICA SINICA, 2009, 58 (03) : 1942 - 1947
  • [30] Electromigration of composite Sn-Ag-Cu solder bumps
    Ashutosh Sharma
    Di Erick Xu
    Jasper Chow
    Michael Mayer
    Heung-Rak Sohn
    Jae Pil Jung
    Electronic Materials Letters, 2015, 11 : 1072 - 1077
12345