Yield & Reliability challenges of BEOL Interconnects

被引：0

作者：

Tan, J. B. ^{[1
]}

Zhang, B. C. ^{[1
]}

Tang, T. J. ^{[1
]}

Perera, C. ^{[1
]}

Lim, Y. K. ^{[1
]}

Siew, Y. K. ^{[1
]}

Fe, Y. C. ^{[1
]}

Lu, W. ^{[1
]}

Liu, H. ^{[1
]}

Seet, C. S. ^{[1
]}

Zhang, H. ^{[1
]}

Lim, S. K. ^{[1
]}

Chua, S. T. ^{[1
]}

Ismail, Z. ^{[1
]}

Seah, B. M. ^{[1
]}

Ee, P. Y. ^{[1
]}

Vigar, D. ^{[1
]}

Hsia, L. C. ^{[1
]}

机构：

[1] Chartered Semicond Mfg Ltd, 60 Woodlands Ind Pk D,St 2, Singapore 738406, Singapore

来源：

PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2006年

关键词：

D O I：

暂无

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

This paper analyses a few key yield and reliability challenges of the Back-End-Of-Line (BEOL) interconnects. A discussion of the failure modes and mechanisms are elaborated on challenges arising from weak patterning, missing trench and plasma charging effect. Enhancement of via and bond pad reliability are also discussed.

引用

页码：6 / +

页数：2

共 50 条

[41] Design for reliability with AuSn interconnects
Dudek, Rainer
Wittler, Olaf
Faust, Wolfgang
Braemer, Birgit
Klein, Matthias
Jun, Wei
Michel, Bernd
EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 183 - 189
[42] Reliability of Hybrid Bond Interconnects
Gambino, J. P.
Winzenread, R.
Thomas, K.
Muller, R.
Truong, H.
Defibaugh, D.
Price, D.
Goshima, K.
Hirano, T.
Watanabe, Y.
Breen, M.
Oldham, N.
2017 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2017,
[43] Electromigration reliability of advanced interconnects
Hu, C. -K.
Gignac, L. M.
Baker-O'Neal, B.
Liniger, E.
Yu, R.
Flaitz, P.
Stamper, A. K.
STRESS-INDUCED PHENOMENA IN METALLIZATION, 2007, 945 : 27 - +
[44] Reliability Improvement with Optimized BEOL Process in Advanced DRAM
Lee, J. H.
Woo, B. W.
Lee, Y. M.
Lee, N. H.
Lee, S. H.
Lee, Y. S.
Kim, H. S.
Pae, S.
2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2023,
[45] BEOL Reliability Enhancement by Applying New Capping Materials
Chang, Hui-Lin
Chang, Chi Tso
2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,
[46] Microstructure and reliability of copper interconnects
Ryu, C
Kwon, KW
Loke, ALS
Lee, H
Nogami, T
Dubin, VM
Kavari, RA
Ray, GW
Wong, SS
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (06) : 1113 - 1120
[47] RELIABILITY OF PASSIVE FIBEROPTIC INTERCONNECTS
KOPERA, PM
FIBER AND INTEGRATED OPTICS, 1990, 9 (01) : 53 - 59
[48] RELIABILITY OF MGAL SEMICONDUCTOR INTERCONNECTS
PANKRATZ, JM
COLLINS, DR
IEEE TRANSACTIONS ON RELIABILITY, 1970, R 19 (03) : 89 - &
[49] Reliability of MOL local interconnects
Kauerauf, Thomas
Branka, Anna
Sorrentino, Giuseppe
Roussel, Philippe
Demuynck, Steven
Croes, Kristof
Mercha, Karim
Bommels, Jurgen
Tokei, Zsolt
Groeseneken, Guido
2013 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2013,
[50] Impact of Cu TSVs on BEOL Metal and Dielectric Reliability
Li, Yunlong
Croes, Kristof
Nabiollahi, Nabi
Van Huylenbroeck, Stefaan
Gonzalez, Mario
Velenis, Dimitrios
Bender, Hugo
Jourdain, Anne
Pantouvaki, Marianna
Stucchi, Michele
Vanstreels, Kris
Van De Peer, Myriam
De Messemaeker, Joke
Wu, Chen
Beyer, Gerald
De Wolf, Ingrid
Beyne, Eric
2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2014,

← 1 2 3 4 5 →