Yield & Reliability challenges of BEOL Interconnects

被引：0

作者：

Tan, J. B. ^{[1
]}

Zhang, B. C. ^{[1
]}

Tang, T. J. ^{[1
]}

Perera, C. ^{[1
]}

Lim, Y. K. ^{[1
]}

Siew, Y. K. ^{[1
]}

Fe, Y. C. ^{[1
]}

Lu, W. ^{[1
]}

Liu, H. ^{[1
]}

Seet, C. S. ^{[1
]}

Zhang, H. ^{[1
]}

Lim, S. K. ^{[1
]}

Chua, S. T. ^{[1
]}

Ismail, Z. ^{[1
]}

Seah, B. M. ^{[1
]}

Ee, P. Y. ^{[1
]}

Vigar, D. ^{[1
]}

Hsia, L. C. ^{[1
]}

机构：

[1] Chartered Semicond Mfg Ltd, 60 Woodlands Ind Pk D,St 2, Singapore 738406, Singapore

来源：

PROCEEDINGS OF THE IEEE 2006 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2006年

关键词：

D O I：

暂无

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

This paper analyses a few key yield and reliability challenges of the Back-End-Of-Line (BEOL) interconnects. A discussion of the failure modes and mechanisms are elaborated on challenges arising from weak patterning, missing trench and plasma charging effect. Enhancement of via and bond pad reliability are also discussed.

引用

页码：6 / +

页数：2

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