Effects of Outer Shell Layer on the Electronic Transport Behaviors of Sn@SnOx Nanoparticles

被引:2
|
作者
Ding, Ang [1 ]
Li, Tianjun [1 ]
Wang, Dongxing [1 ]
Muhammad, Javid [2 ]
Shah, Asif [2 ]
Dong, Xinglong [2 ]
Zhang, Zhidong [3 ]
机构
[1] Ningbo Univ Technol, Inst Mat, Ningbo 315016, Peoples R China
[2] Dalian Univ Technol, Sch Mat Sci & Engn, Minist Educ, Key Lab Mat Modificat Laser Ion & Elect Beams, Dalian 116024, Peoples R China
[3] Chinese Acad Sci, Int Ctr Mat Phys, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China
来源
基金
中国国家自然科学基金;
关键词
direct‐ current arc discharge; electrical properties; electron– phonon coupling; nanoparticles; superconductivity; CARBON; CONDUCTIVITY;
D O I
10.1002/pssb.202000430
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Tin oxide-encapsulated tin nanoparticles (Sn@SnOx NCs) are in situ prepared by a modified DC arc-discharge plasma process. The as-prepared Sn@SnOx NCs are typically 50-70 nm in diameter with 6 nm of the SnOx shell. The diameter of Sn@SnOx NCs is 50-80 nm and the thickness of the SnOx shell increases to approximate to 25 nm after heat treatment in a vacuum tube furnace. The effect of SnOx shell thickness on the electrical properties of Sn@SnOx NCs is measured by the four-probe technique. The results show that the resistivity is described using Bloch-Gruneisen's equation with SnOx shell thickness-dependent resistivity and SnOx shell thickness-dependent Debye temperature above the superconducting transition temperature T-c. Superconductivity occurs in both Sn@SnOx NCs with different shell thicknesses when the temperature is lower than T-c. The T-c of the two NCs (3.98 K, 4.15 K) is slightly higher than that of the metal block (3.73 K) due to the electron-scattering effect of the particles' surface shell. The resistances of the two samples below T-c show an exponential decay mode, which is the result of the thermally activated phase slip (TAPS) and quantum phase slip (QPS).
引用
收藏
页数:7
相关论文
共 48 条
  • [21] Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
    Zhao, Xu
    Saka, Masumi
    Muraoka, Mikio
    Yamashita, Mitsuo
    Hokazono, Hiroaki
    JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (11) : 4179 - 4185
  • [22] Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
    Xu Zhao
    Masumi Saka
    Mikio Muraoka
    Mitsuo Yamashita
    Hiroaki Hokazono
    Journal of Electronic Materials, 2014, 43 : 4179 - 4185
  • [23] Electronic waste as a source of rare earth element pollution: Leaching, transport in porous media, and the effects of nanoparticles
    Brewer, Aaron
    Dror, Ishai
    Berkowitz, Brian
    CHEMOSPHERE, 2022, 287
  • [24] Effects of Metal (Ag, Sn and Zn) Nanoparticles Inserted into MgB2 Grain Boundaries on Transport and Superconducting Properties
    Akamaru, Satoshi
    Ishikawa, Fumitaka
    Nishimura, Katsuhiko
    Abe, Takayuki
    Matsuyama, Masao
    MATERIALS TRANSACTIONS, 2013, 54 (12) : 2258 - 2264
  • [25] Effects of CdSe shell layer on the electrical properties of nonvolatile memory devices fabricated utilizing core-shell CdTe-CdSe nanoparticles embedded in a poly(9-vinylcarbazole) layer
    Yun, Dong Yeol
    Jung, Jae Hun
    Lee, Dea Uk
    Kim, Tae Whan
    Ryu, E. D.
    Kim, S. W.
    APPLIED PHYSICS LETTERS, 2010, 96 (12)
  • [26] Effects of strain and electric fields on the electronic transport properties of single-layer β12-borophene nanoribbons
    Davoudiniya, M.
    Mirabbaszadeh, K.
    PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2021, 23 (34) : 18647 - 18658
  • [27] Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints
    Shengyan Shang
    Anil Kunwar
    Yanfeng Wang
    Jinye Yao
    Yingchao Wu
    Haitao Ma
    Yunpeng Wang
    Electronic Materials Letters, 2019, 15 : 253 - 265
  • [28] A novel PPF Technique--Sn-PPF: Effects of in-situ formation Cu-Sn-ni intermetallic nano-layer on electronic packaging performances
    Liu, Lilin
    Fu, Ran
    Liu, Deming
    Zhang, Tongyi
    ADVANCED ELECTRONIC PACKAGING, 2007, 968 : 95 - +
  • [29] Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction
    Yang, L. M.
    Zhang, Z. F.
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (12) : 3552 - 3558
  • [30] Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction
    L. M. Yang
    Z. F. Zhang
    Journal of Electronic Materials, 2013, 42 : 3552 - 3558