Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

被引：0
|
作者：
Shengyan Shang
Anil Kunwar
Yanfeng Wang
Jinye Yao
Yingchao Wu
Haitao Ma
Yunpeng Wang
机构：
[1] Dalian University of Technology,School of Materials Science and Engineering
[2] Dalian University of Technology,School of Mechanical Engineering
[3] KU Leuven,Department of Materials Engineering
来源：
Electronic Materials Letters | 2019年 / 15卷
关键词：
Electronic materials; Intermetallic compounds; Crystal growth; Thermogravimetric analysis; Diffusion; Finite element method;
D O I：
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学科分类号：
摘要：
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页码：253 / 265
页数：12
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