Microfabrication of polymers using KrF Excimer laser beam

被引:0
|
作者
Shin, Dong Sig [1 ]
Lee, Jae Hoon [1 ]
Suh, Jeong [1 ]
机构
[1] Korea Inst Machinery & Mat, IT Machinery Res Ctr, 171 Jang Dong, Taejon 305343, South Korea
关键词
Excimer laser; ablation; polymer; polyimide; surface debris; erasable ink; debris-free porcess;
D O I
10.4028/www.scientific.net/KEM.326-328.115
中图分类号
Q81 [生物工程学(生物技术)]; Q93 [微生物学];
学科分类号
071005 ; 0836 ; 090102 ; 100705 ;
摘要
Pulsed UV laser beams, which are widely used in the processing of polymers, offer many advantages in the field of polymer production, primarily because their photon energy is higher than the binding energy of the polymer. In particular, the fabrication of polymers with an excimer laser process is faster and more convenient than with other processes. Nevertheless, some problems occur in the precision microprocessing of polymers, including the formation and deposition Of Surface debris, which is produced from the breakdown of either polymer chains or radical bonds. In the present work, a process for eliminating carbonized surface debris contamination generated by the laser ablation of a polymer was developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on the polymer. The Surface debris ejected from the polymer is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer can be removed using adhesive tape.
引用
收藏
页码:115 / +
页数:2
相关论文
共 50 条
  • [31] Multiwavelength excitation processing using F2 and KrF excimer lasers for precision microfabrication of hard materials
    Sugioka, K
    Akane, T
    Obata, K
    Toyoda, K
    Midorikawa, K
    APPLIED SURFACE SCIENCE, 2002, 197 : 814 - 821
  • [32] TIME-RESOLVED REFLECTIVITY MEASUREMENTS ON SILICON AND GERMANIUM USING A PULSED EXCIMER KRF LASER-HEATING BEAM
    JELLISON, GE
    LOWNDES, DH
    MASHBURN, DN
    WOOD, RF
    PHYSICAL REVIEW B, 1986, 34 (04): : 2407 - 2415
  • [33] Dry cleaning technology of silicon wafer with a line beam for semiconductor fabrication by KrF excimer laser
    Kim, DJ
    Kim, YK
    Ryu, JK
    Kim, HJ
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2002, 41 (7A): : 4563 - 4570
  • [34] Micromachining of polyurethane (PU) polymer using a KrF excimer laser (248 nm)
    Singh, Sarabpreet
    Sharma, Sunil
    APPLIED SURFACE SCIENCE, 2014, 321 : 289 - 301
  • [35] RAMAN-SCATTERING MEASUREMENTS IN FLAMES USING A TUNABLE KRF EXCIMER LASER
    WEHRMEYER, JA
    CHENG, TS
    PITZ, RW
    APPLIED OPTICS, 1992, 31 (10): : 1495 - 1504
  • [36] Characterization of MEMS Structure on Silicon Wafer using KrF Excimer Laser Micromachining
    Mazalan, M.
    Johari, S.
    Ng, B. P.
    Wahab, Y.
    2014 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE), 2014, : 217 - 220
  • [37] The comparison of ITO ablation characteristics using KrF excimer and Nd:YAG laser
    Lee, K
    Lee, C
    SECOND INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, 2002, 4426 : 260 - 263
  • [38] MEMS structures characterization on PMMA layer using KrF excimer laser micromachining
    Saadon, S.
    Wahab, Y.
    Guang, A. T.
    JOURNAL OF OPTOELECTRONICS AND ADVANCED MATERIALS, 2015, 17 (9-10): : 1265 - 1271
  • [39] DEPOSITION OF TRANSPARENT ZRO2 ON POLYETHERIMIDE USING A KRF EXCIMER LASER
    CHUANG, MC
    SMITH, GA
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (04): : 2397 - 2399
  • [40] Simultaneous fabrication of thousands of holes using high power KrF excimer laser
    Sekizawa, N
    Niwatsukino, Y
    Sajiki, K
    Nire, T
    CLEO(R)/PACIFIC RIM 2001, VOL I, TECHNICAL DIGEST, 2001, : 318 - 319