Aspects of the structural evolution of lead-free solder joints

被引：25
|
作者：
Zribi, A
Kinyanjui, R
Borgesen, P
Zavalij, L
Cotts, EJ
机构：
[1] SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA
[2] SUNY Binghamton, Mat Sci Program, Binghamton, NY 13902 USA
[3] Universal Instruments Corp, Kirkwood, NY USA
来源：
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 2002年 / 54卷 / 06期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1007/BF02701848
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Studies of the formation of intermetallic compounds at some lead-free solder/ metallization interfaces are briefly reviewed in this article. SnAgCu/Ni and SnAgCu/Cu interfaces are examined in particular. It has been found that (Cu,Ni)(6)Sn-5 forms at SnAgCu/Ni interfaces until copper is depleted from the solder matrix. This article also contrasts the formation of (Au,Ni)Sn-4 and related compounds in PbSn/Ni solder joints and lead-free solder joints.
引用
收藏
页码：38 / 40
页数：3
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