A Simulation of Intelligent Power Module Under Power Cycling Condition

被引：0

作者：

Wang, Yong ^{[1
]}

Zhao, Wen ^{[1
]}

Li, Ming ^{[1
]}

Chen, Ming ^{[2
]}

Gao, Liming ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200030, Peoples R China

[2] Shanghai Belling Corp Ltd, Power Device Grp, Shanghai, Peoples R China

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

IPM; Power cycling; FEA;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

this paper focuses on the performance of IPM (Intelligent Power Module) under power cycling test which is simulated by a FEA (Finite Element Analysis) method. Through the method of control variables some properties can be obtained. The key parameters in the calculation include power dissipation of silicon chip, cycle period, different materials of ceramic substrate and solder layer thickness. A series of factors are adopted in the simulation to evaluate the influence of power cycling test on IPM. The disciplinary conclusion can be a suggestion for package design.

引用

页码：1015 / 1020

页数：6

共 50 条

[21] A novel power module design and technology for improved power cycling capability
Scheuermann, U
Herr, E
MICROELECTRONICS RELIABILITY, 2001, 41 (9-10) : 1713 - 1718
[22] Power cycling tests under driving ΔTj=125 °C on the Cu clip bonded EV power module
Kim, Dongjin
Lee, Byeongsoo
Lee, Tae-Ik
Noh, Seungjun
Choe, Chanyang
Park, Semin
Kim, Min-Su
MICROELECTRONICS RELIABILITY, 2022, 138
[23] Intelligent perception of power grid condition
Tang, Ju
Zeng, Fuping
HIGH VOLTAGE, 2021, 6 (06) : 923 - 923
[24] Advanced power cycler with intelligent monitoring strategy of IGBT module under test
Choi, U. M.
Blaabjerg, F.
Iannuzzo, F.
MICROELECTRONICS RELIABILITY, 2017, 76 : 522 - 526
[25] Comparison and Analysis of Power cycling and thermal cycling Lifetime of IGBT Module
Zhang, Jin
Qiu, Zhijie
Zhang, Erxiong
Ning, Puqi
2018 21ST INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS (ICEMS), 2018, : 876 - 880
[26] Failure Analysis of IGBT in Intelligent Power Module
Ning, Tao
Yang, Shao Hua
Peng, Ze Yang
2013 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD), 2013, : 225 - 228
[27] Comprehensive Study on the Encapsulation for the Intelligent Power Module
Lim, Simon Siak Boon
Ching, Eva Wai Leong
Yamamoto, Kazunori
Yue, Tang Gong
2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 555 - 559
[28] Intelligent power module for white goods applications
Widler, HJ
Parker, Z
ELECTRONIC ENGINEERING, 1999, 71 (864): : 19 - 19
[29] New Reliable Inverter with Intelligent Power Module
Jung, Euney
Hwang, Jin-Ha
Lee, Ju-Kwang
Joung, Gyu-Bum
2015 9TH INTERNATIONAL CONFERENCE ON POWER ELECTRONICS AND ECCE ASIA (ICPE-ECCE ASIA), 2015, : 2730 - 2736
[30] The Solder Life Prediction Model of Power Module under Thermal Cycling Test (TCT)
Chen, Hao-Chih
Guo, Siao-Wei
Liao, Hsueh-Kuo
2018 13TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2018, : 104 - 107

← 1 2 3 4 5 →