First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide

被引:5
|
作者
Jaeger, Richard C. [1 ]
Chen, Jun [2 ]
Suhling, Jeffrey C. [2 ]
Fursin, Leonid [3 ]
机构
[1] Auburn Univ, Dept Elect & Comp Engn, Auburn, AL 36849 USA
[2] Auburn Univ, Dept Mech Engn, Auburn, AL 36849 USA
[3] United Silicon Carbide Inc, Monmouth Jct, NJ 08852 USA
关键词
Silicon carbide; NMOSFET; piezoresistance; mechanical stress; stress sensor; stress sensor rosette; CMOS SENSOR ARRAYS; STRESS SENSORS; COMPONENTS;
D O I
10.1109/JSEN.2019.2905787
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Stress dependent properties and modeling of lateral enhancement-mode NMOS FETS on 4H silicon carbide are described in detail for a wide range of bias conditions. NFET stress response is shown to include a strong threshold voltage component in addition to the expected mobility component, and a theoretical model for the stress dependencies closely matches the measured data. Values of the longitudinal and transverse piezoresistive coefficients are extracted from linear region measurements of the MOS transistors as a function of gate drive for the both crystallographic and chip coordinate systems. At low gate drive, threshold variations become much more important than the classic mobility terms, whereas high gate drive is utilized to extract the mobility terms from the data. Design of a four-transistor temperature compensated stress sensor rosette that requires a value of only one combined piezoresistive coefficient is also presented.
引用
收藏
页码:6037 / 6045
页数:9
相关论文
共 50 条
  • [41] A Study of the Elastic Constants of 4H Silicon Carbide (4H-SiC)
    Chen, Jun
    Fahim, Abdullah
    Suhling, Jeffrey C.
    Jaeger, Richard C.
    PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019), 2019, : 835 - 840
  • [42] Muonium states and dynamics in 4H and 6H silicon carbide
    Bani-Salameh, HN
    Celebi, YG
    Chow, KH
    Coss, BE
    Cox, SFJ
    Lichti, RL
    PHYSICA B-CONDENSED MATTER, 2006, 374 : 368 - 371
  • [43] Hyperfine spectroscopy of muonium in 4H and 6H silicon carbide
    Lichti, RL
    Nussbaum, WA
    Chow, KH
    PHYSICAL REVIEW B, 2004, 70 (16): : 1 - 6
  • [44] 4H Silicon Carbide Etching Using Chlorine Trifluoride Gas
    Habuka, Hitoshi
    Katsumi, Yusuke
    Miura, Yutaka
    Tanaka, Keiko
    Fukai, Yasushi
    Fukae, Takaya
    Gao, Yuan
    Kato, Tomohisa
    Okumura, Hajime
    Arai, Kazuo
    SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2, 2009, 600-603 : 655 - +
  • [45] Boron-related defect centers in 4H silicon carbide
    Troffer, T
    Hassler, C
    Pensl, G
    Holzlein, K
    Mitlehner, H
    Volkl, J
    SILICON CARBIDE AND RELATED MATERIALS 1995, 1996, 142 : 281 - 284
  • [46] Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles
    Protik, Nakib Haider
    Katre, Ankita
    Lindsay, Lucas
    Carrete, Jesus
    Mingo, Natalio
    Broido, David
    MATERIALS TODAY PHYSICS, 2017, 1 : 31 - 38
  • [47] Acoustic Delay Lines to Measure Piezoelectricity in 4H Silicon Carbide
    Yu, Pen-Li
    Bhave, Sunil A.
    2017 JOINT CONFERENCE OF THE EUROPEAN FREQUENCY AND TIME FORUM AND IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM (EFTF/IFC), 2017, : 139 - 142
  • [48] Theory of the stark effect on the donor levels in 4H silicon carbide
    Ivanov, I. G.
    Janzen, E.
    SILICON CARBIDE AND RELATED MATERIALS 2006, 2007, 556-557 : 435 - +
  • [49] Study of avalanche breakdown and impact ionization in 4H silicon carbide
    Konstantinov, AO
    Wahab, Q
    Nordell, N
    Lindefelt, U
    JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (04) : 335 - 341
  • [50] Chemical-Mechanical Polishing of 4H Silicon Carbide Wafers
    Wang, Wantang
    Lu, Xuesong
    Wu, Xinke
    Zhang, Yiqiang
    Wang, Rong
    Yang, Deren
    Pi, Xiaodong
    ADVANCED MATERIALS INTERFACES, 2023, 10 (13)