A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node

被引：7
|
作者：
Hu, Yu-Chen [1 ]
Lin, Chun-Pin [2 ]
Chang, Yao-Jen [1 ]
Chang, Nien-Shyang [2 ]
Sheu, Ming-Hwa [2 ]
Chen, Chi-Shi [2 ]
Chen, Kuan-Neng [1 ]
机构：
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30050, Taiwan
[2] Natl Appl Res Labs, Chip Implementat Ctr, Hsinchu 300, Taiwan
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 2015年 / 62卷 / 12期
关键词：
3-D integration; heterogeneous;
D O I：
10.1109/TED.2015.2487041
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A novel 3-D chip-level heterogeneous integration scheme for low cost and rapid pilot demonstration is proposed in this paper. The conventional Bumping fabrication is done at wafer level. However, due to the high cost of whole wafer, opting for chips with advanced technology node is a better alternative. Therefore, with the difficulties of the bumping process at chip level, 3-D heterogeneous integration by chip stacking faces challenges. This paper presents a novel heterogeneous integration platform by using electroless plating on chips and pillar bump on wafers before stacking. This integration platform can be applied to chip-to-chip or chip-to-wafer scheme when chips are fabricated from costly advanced technology node.
引用
收藏
页码：4343 / 4348
页数：6
相关论文
共 48 条
  • [21] Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology
    Lee, K-W.
    Hashimoto, H.
    Onishi, M.
    Konno, S.
    Sato, Y.
    Nagai, C.
    Bea, J-C
    Murugesan, M.
    Fukushima, T.
    Tanaka, T.
    Koyanagi, M.
    2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2014,
  • [22] Density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors
    Temple, D.
    Bower, C. A.
    Malta, D.
    Robinson, J. E.
    Coffman, P. R.
    Skokan, M. R.
    Welch, T. B.
    2006 INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2, 2006, : 827 - +
  • [23] An Inductive-Coupling Bus with Collision Detection Scheme Using Magnetic Field Variation for 3-D Network-on-Chips
    Kadomoto, Junichiro
    Miyata, Tomoki
    Amano, Hideharu
    Kuroda, Tadahiro
    2016 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC), 2016, : 41 - 44
  • [24] Integration of CMOS Image Sensor and Microwell Array Using 3-D WLCSP Technology for Biodetector Application
    Zhao, Shuai
    Yu, Daquan
    Zou, Yichao
    Yang, Chaodong
    Yang, Xiaobing
    Xiao, Zhiyi
    Chen, Pei
    Qin, Fei
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (04): : 624 - 632
  • [25] Improving treatment of VOCs by integration of absorption columns into electrochemical cells using 3-D printing technology
    Granados-Fernandez, Rafael
    Montiel, Miguel A.
    Arias, Andrea N.
    Fernandez-Marchante, Carmen M.
    Lobato, Justo
    Rodrigo, Manuel A.
    ELECTROCHIMICA ACTA, 2023, 451
  • [26] A Novel 3-D Printed Loop Antenna Using Flexible NinjaFlex Material for Wearable and IoT applications
    Nate, Kunal
    Tentzeris, Manos M.
    2015 IEEE 24TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2015, : 171 - 173
  • [27] A Novel Double-Sided Etching and Electroplating Fabrication Scheme for Coaxial Through-Silicon-Vias in 3-D Integration
    Chen, Zhiming
    Chen, Xuyan
    Wang, Han
    Cai, Ziru
    Xiong, Miao
    Hao, Yigang
    Ding, Yingtao
    Zhang, Ziyue
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (10) : 6249 - 6253
  • [28] A Novel Read Scheme Using GIDL Current to Suppress Read Disturbance in 3-D nand Flash Memories
    Jo, Hyungjun
    Kim, Jongwoo
    Shin, Hyungcheol
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2023, 42 (12) : 5151 - 5155
  • [29] System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory
    Rocha, Leandro M. Giacomini
    Naeim, Mohamed
    Paim, Guilherme
    Brunion, Moritz
    Venugopal, Priya
    Milojevic, Dragomir
    Myers, James
    Badaroglu, Mustafa
    Verhelst, Marian
    Ryckaert, Julien
    Biswas, Dwaipayan
    IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 2024, 10 : 125 - 134
  • [30] 3D heterogeneous integration technology using hot via MMIC and silicon interposer with millimeter wave application
    Zhou, Jun
    Yang, Jiapeng
    Shen, Ya
    2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2017, : 495 - 498
12345