Short-circuit Failure Mechanism of SiC Double-trench MOSFET

被引:0
|
作者
Hu, Dongqing [1 ]
Xia, Tian [1 ]
Zhou, Xintian [1 ]
Jia, Yunpeng [1 ]
Wu, Yu [1 ]
Yin, Shan [2 ]
机构
[1] Beijing Univ Technol, Fac Informat Technol, Beijing, Peoples R China
[2] China Acad Engn Phys, Inst Elect Engn, Mianyang, Sichuan, Peoples R China
关键词
Silicon Carbide double-trench MOSFET; power semiconductor reliability; short-circuit;
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The purpose of this paper is to explore the failure mechanism of 650V state-of-the-art SiC double-trench MOSFETs under short-circuit (SC) test. The experimental results demonstrate drain voltage (VDS) has a pronounced influence on the SC capability of the device, and different VDS will lead to discrepant failure mechanisms. The gate-to-source oxide rupture is most likely to occur when a lower VDS is imposed on the studied device. However, the breakdown of the gate-to-source and drain-to-source takes place simultaneously with a higher VDS. And the reason will be discussed in this work.
引用
收藏
页码:696 / 699
页数:4
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