Fracture toughness of aluminum nitride ceramics at cryogenic temperatures

被引:4
|
作者
Wei, Sai [1 ]
Xie, Zhipeng [1 ]
Xue, Weijiang [1 ]
Yi, Zhongzhou [2 ]
Chen, Juan [1 ]
Cheng, Lixia [1 ]
机构
[1] Tsinghua Univ, Sch Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China
[2] Honghe Univ, Coll Sci, Honghe 661100, Yunnan, Peoples R China
关键词
Toughness and toughening; Grain boundary; Cryogenic temperatures; THERMAL-CONDUCTIVITY; ELECTRON-MICROSCOPY; ALN CERAMICS; GRAIN-SIZE; INSULATION; STRENGTH; BEHAVIOR; MODE;
D O I
10.1016/j.ceramint.2014.05.012
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We reported, for the first time, the fracture toughness of aluminum nitride ceramics at cryogenic temperatures. The fracture toughness increased from 3.98 +/- 0.19 to 4.59 +/- 0.28 MPa m(1/2) with the decreasing temperature from 293 to 77 K. Increasing fraction of transgranular fracture (from 7.3% at 293 K to 14.5% at 77 K) was proposed as a governing mechanism for toughness improvement at cryogenic temperatures based on the experimental observations. The effect of residual stresses on crack propagation was theoretically analyzed, considering energy release rates of intergranular and transgranular fractures. The variation of crack paths would contribute to the change of fracture modes and fracture toughness at cryogenic temperatures. (C) 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved.
引用
收藏
页码:13715 / 13718
页数:4
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