Thermocurable polymers as resists for imprint lithography

被引：4

作者：

Tormen, M ^{[1
]}

Borzenko, T ^{[1
]}

Schmidt, G ^{[1
]}

Liu, J ^{[1
]}

Molenkamp, LW ^{[1
]}

机构：

[1] Univ Wurzburg, Inst Phys, D-97074 Wurzburg, Germany

来源：

ELECTRONICS LETTERS | 2000年 / 36卷 / 11期

关键词：

D O I：

10.1049/el:20000708

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In nanoimprint lithography, high pressures are utilised for embossing thermoplastics. This may introduce mechanical strain in the mould and the sample. By using a thermocurable polymer (polydimethylsiloxane, PDMS), a low pressure imprint process, working at pressures of < 0.2MPa, has proven viable. The new process may drastically reduce the thermal budget and the mechanical load in imprint lithography.

引用

页码：983 / 984

页数：2

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