Thermocurable polymers as resists for imprint lithography

被引：4
|
作者：
Tormen, M [1 ]
Borzenko, T [1 ]
Schmidt, G [1 ]
Liu, J [1 ]
Molenkamp, LW [1 ]
机构：
[1] Univ Wurzburg, Inst Phys, D-97074 Wurzburg, Germany
来源：
ELECTRONICS LETTERS | 2000年 / 36卷 / 11期
关键词：
D O I：
10.1049/el:20000708
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In nanoimprint lithography, high pressures are utilised for embossing thermoplastics. This may introduce mechanical strain in the mould and the sample. By using a thermocurable polymer (polydimethylsiloxane, PDMS), a low pressure imprint process, working at pressures of < 0.2MPa, has proven viable. The new process may drastically reduce the thermal budget and the mechanical load in imprint lithography.
引用
收藏
页码：983 / 984
页数：2
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