共 50 条
- [42] Lead-free tin alloys as substitutes for tin-lead alloy plating Trans Inst Met Finish, Pt 4 (149-153):
- [43] Directional solidification of eutectic SnAgCu solder alloy Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2013, 42 (05): : 1048 - 1052
- [44] Lead-free tin alloys as substitutes for tin-lead alloy plating TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1997, 75 : 149 - 153
- [46] The interdiffusion in melts of tin-lead system of eutectic and near-eutectic composition High Temperature, 2008, 46 : 212 - 217
- [47] Electromigration in eutectic tin-lead solder lines at the device temperature 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 160 - 163
- [49] Thermomigration in eutectic tin-lead flip chip solder joints EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 565 - 569