共 50 条
- [32] FATIGUE OF LOW-TIN LEAD-BASED AND TIN-LEAD EUTECTIC SOLDERS MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 255 - 259
- [33] Influence of Directional Solidification on the Creep Properties of a Binary NbSi Eutectic Alloy JOM, 2014, 66 : 1908 - 1913
- [35] SURFACE-COMPOSITION OF A TIN-LEAD ALLOY JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (04): : 939 - 942
- [36] ELECTRODEPOSITION OF BRIGHT COATINGS WITH TIN-LEAD ALLOY PROTECTION OF METALS, 1980, 16 (04): : 407 - 408
- [37] DIRECTIONAL SOLIDIFICATION OF LEAD-SODIUM EUTECTIC ZEITSCHRIFT FUR METALLKUNDE, 1975, 66 (05): : 265 - 267