Operation characteristics of Poly-Si nanowire charge-trapping flash memory devices with SiGe and Ge buried channels

被引:2
|
作者
Fang, Hsin-Kai [1 ]
Chang-Liao, Kuei-Shu [1 ]
Huang, Chien-Pang [1 ]
Lee, Wei-Zhi [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu, Taiwan
关键词
Ge buried channel; Poly-Si; Nanowire; Charge-trapping flash memory device; ERASING SPEEDS;
D O I
10.1016/j.vacuum.2016.12.042
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Operation characteristics of polycrystalline silicon (poly-Si) nanowire (NW) charge-trapping (CT) flash memory devices with a SiGe and a Ge buried channel are studied and compared in this work. The poly-Si NW devices with a Ge buried channel show faster programming and erasing speeds as compared to those with a SiGe one due to a lower energy barrier in tunneling layer with more Ge composition. The retention and endurance characteristics of devices with a Ge buried channel are similar to those with a SiGe one. Ge buried channel is promising to CI' flash device for 3D nonvolatile memory applications. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:53 / 57
页数:5
相关论文
共 50 条
  • [41] Impact of channel dangling bonds on reliability characteristics of flash memory on poly-Si thin films
    Lin, Yu-Hsien
    Chien, Chao-Hsin
    Chou, Tung-Huan
    Chao, Tien-Sheng
    Lei, Tan-Fu
    IEEE ELECTRON DEVICE LETTERS, 2007, 28 (04) : 267 - 269
  • [42] Gate-all-around floating-gate memory device with triangular poly-Si nanowire channels
    Tsai, Jung-Ruey
    Lee, Ko-Hui
    Lin, Horng-Chih
    Huang, Tiao-Yuan
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (04)
  • [43] Low-Temperature Poly-Si TFT Charge Trap Flash Memory with Sputtered ONO and Schottky Junctions
    An, Ho-Myoung
    Kim, Jooyeon
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2015, 16 (04) : 187 - 189
  • [44] Random Telegraph Noise and Radiation Response of 80 nm Vertical Charge-Trapping NAND Flash Memory Devices With SiON Tunneling Oxide
    Wynocker, Isabella R.
    Zhang, En Xia
    Reed, Robert A.
    Schrimpf, Ronald D.
    Arreghini, Antonio
    Bastos, Joao P.
    van den Bosch, Geert
    Linten, Dimitri
    Fleetwood, Daniel M.
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2024, 71 (08) : 1789 - 1797
  • [45] Impacts of Operation Intervals on Program Disturb in 3D Charge-trapping Triple-level-cell (TLC) NAND Flash Memory
    Fang, Xiaotong
    Kong, Yachen
    Guo, Yifan
    Jia, Menghua
    Zhan, Xuepeng
    Li, Yuan
    Chen, Jiezhi
    2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
  • [46] The roles of the dielectric constant and the relative level of conduction band of high-k composite with Si in improving the memory performance of charge-trapping memory devices
    Lu, Jianxin
    Gong, Changjie
    Ou, Xin
    Lu, Wei
    Yin, Jiang
    Xu, Bo
    Xia, Yidong
    Liu, Zhiguo
    Li, Aidong
    AIP ADVANCES, 2014, 4 (11)
  • [47] High-Performance Charge-Trapping Flash Memory Device With an Ultrathin 2.5-nm Equivalent-Si3N4-Thickness Trapping Layer
    Tsai, C. Y.
    Chin, Albert
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (01) : 252 - 254
  • [48] Poly-Si Thin-Film Transistor Nonvolatile Memory Using Ge Nanocrystals as a Charge Trapping Layer Deposited by the Low-Pressure Chemical Vapor Deposition
    Kuo, Po-Yi
    Chao, Tien-Sheng
    Huang, Jyun-Siang
    Lei, Tan-Fu
    IEEE ELECTRON DEVICE LETTERS, 2009, 30 (03) : 234 - 236
  • [49] Improvement of poly-Si channel vertical charge trapping NAND devices characteristics by high pressure D2/H2 annealing.
    Breuil, L.
    Lisoni, J. G.
    Delhougne, R.
    Tan, C. L.
    Van Houdt, J.
    Van den Bosch, G.
    Furnemont, A.
    2016 IEEE 8TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2016,
  • [50] A CMOS-Compatible Poly-Si Nanowire Device with Hybrid Sensor/Memory Characteristics for System-on-Chip Applications
    Chen, Min-Cheng
    Chen, Hao-Yu
    Lin, Chia-Yi
    Chien, Chao-Hsin
    Hsieh, Tsung-Fan
    Horng, Jim-Tong
    Qiu, Jian-Tai
    Huang, Chien-Chao
    Ho, Chia-Hua
    Yang, Fu-Liang
    SENSORS, 2012, 12 (04) : 3952 - 3963