ESD Shielding of Thermoformed Clam Shell Packaging

被引：0
|
作者：
Viheriakoski, Toni [1 ]
Fung, Rita [2 ]
Wong, Richard [2 ]
Gaertner, Reinhold [3 ]
Smallwood, Jeremy [4 ]
Tamminen, Pasi [5 ]
机构：
[1] Cascade Metrol, Hakulintie 32, Lohja 08500, Finland
[2] Cisco Syst Inc, 170 W Tasman Dr, San Jose, CA 95134 USA
[3] Infineon Technol AG, POB 800949, D-81609 Munich, Germany
[4] Electrostat Solut Ltd, 13 Redhill Crescent, Southampton, Hants, England
[5] EDR&Medeso Oy, Kalevantie 2, Tampere, Finland
来源：
2018 40TH ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM (EOS/ESD) | 2018年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Clam shells can provide better ESD protection than shielding bags. Energy coupling in a near field is generally reduced by preventing a direct connection, decreasing capacitive coupling, and increasing breakdown field strength. A properly qualified shielding bag may have unexpected weakness in ESD protection due to the low breakdown field strength.
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页数：10
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