ESD SHIELDING WITHOUT METALLIZATION OR CONDUCTIVE FIBERS

被引：0
|
作者：
HALPERIN, SA
机构：
[1] Stephen Halperin & Associates, Ltd, Bensenville, United States
来源：
EE-EVALUATION ENGINEERING | 1994年 / 33卷 / 09期
关键词：
Air-gap packaging - Electrostatic discharge (ESD) - ESD shielding;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：68 / &
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