Fine grained 3D cache architecture using high density TSVs

被引：0
|
作者：
Miro-Panades, Ivan [1 ]
机构：
[1] CEA, LETI, MINATEC Grenoble, Grenoble, France
来源：
2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2013年
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D O I：
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页数：28
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