Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions

被引：51
|
作者：
Schuster, CE [1 ]
Vangel, MG [1 ]
Schafft, HA [1 ]
机构：
[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA
来源：
MICROELECTRONICS RELIABILITY | 2001年 / 41卷 / 02期
关键词：
D O I：
10.1016/S0026-2714(00)00227-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Improved values for the resistivity, rho, of pure, bulk copper from 50 to 1200 K, and their confidence intervals, are developed by extending the analysis of Matula. A recommended value for d rho /dT and its confidence interval in the temperature range of 290-425 K is developed for use with Matthiessen's rule to calculate the electrical thickness of thin copper films and the cross-sectional area of copper lines from resistance measurements at two temperatures. Error analyses are used to estimate the uncertainty with which the electrical thickness and cross-sectional area can be determined. Values for the temperature coefficient of resistance of pure, bulk copper are also provided. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：239 / 252
页数：14
相关论文
共 50 条
  • [41] The determination of copper at thin film electrodes by constant current stripping potentiometry
    Bradshaw, MP
    Scollary, GR
    ELECTROANALYSIS, 1997, 9 (04) : 320 - 324
  • [42] Electrical resistivity of gold thin film as a function of film thickness
    Gilani, T. H.
    Rabchuk, Dian
    CANADIAN JOURNAL OF PHYSICS, 2018, 96 (03) : 272 - 274
  • [43] ELECTRICAL CHARACTERISTICS OF COPPER/POLYIMIDE THIN-FILM MULTILAYER INTERCONNECTS.
    Lane, Thomas A.
    Belcourt, Frank J.
    Jensen, Ronald J.
    1600, (CHMT-10):
  • [44] Enthalpy, heat of fusion and specific electrical resistivity of pure silver, pure copper and the binary Ag-28Cu alloy
    Cagran, C.
    Wilthan, B.
    Pottlacher, G.
    THERMOCHIMICA ACTA, 2006, 445 (02) : 104 - 110
  • [45] Effect of Carbon Content on the Electrical Resistivity of Electrodeposited Copper
    Osaka, Tetsuya
    Yamachika, Noriyuki
    Yoshino, Masahiro
    Hasegawa, Madoka
    Negishi, Yoshinori
    Okinaka, Yutaka
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2009, 12 (03) : D15 - D17
  • [46] Properties of vacancies in copper determined by electrical resistivity techniques
    Schule, W
    ZEITSCHRIFT FUR METALLKUNDE, 1998, 89 (10): : 672 - 677
  • [47] Increase in electrical resistivity of copper and aluminum fine lines
    Hanaoka, Y
    Hinode, K
    Takeda, K
    Kodama, D
    MATERIALS TRANSACTIONS, 2002, 43 (07) : 1621 - 1623
  • [48] ON THE ELECTRICAL-RESISTIVITY OF COPPER-NICKEL-ALLOYS
    THOMAS, H
    ZEITSCHRIFT FUR METALLKUNDE, 1980, 71 (04): : 209 - 214
  • [49] ELECTRICAL-RESISTIVITY OF COPPER, GOLD, PALLADIUM, AND SILVER
    MATULA, RA
    JOURNAL OF PHYSICAL AND CHEMICAL REFERENCE DATA, 1979, 8 (04) : 1147 - 1298
  • [50] LOW TEMPERATURE ELECTRICAL RESISTIVITY OF VARIOUS PURITIES OF COPPER
    CLARK, AF
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1971, 16 (03): : 344 - &
12345