Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions

被引：51
|
作者：
Schuster, CE [1 ]
Vangel, MG [1 ]
Schafft, HA [1 ]
机构：
[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA
来源：
MICROELECTRONICS RELIABILITY | 2001年 / 41卷 / 02期
关键词：
D O I：
10.1016/S0026-2714(00)00227-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Improved values for the resistivity, rho, of pure, bulk copper from 50 to 1200 K, and their confidence intervals, are developed by extending the analysis of Matula. A recommended value for d rho /dT and its confidence interval in the temperature range of 290-425 K is developed for use with Matthiessen's rule to calculate the electrical thickness of thin copper films and the cross-sectional area of copper lines from resistance measurements at two temperatures. Error analyses are used to estimate the uncertainty with which the electrical thickness and cross-sectional area can be determined. Values for the temperature coefficient of resistance of pure, bulk copper are also provided. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：239 / 252
页数：14
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