Improved estimation of the resistivity of pure copper and electrical determination of thin copper film dimensions

被引:51
|
作者
Schuster, CE [1 ]
Vangel, MG [1 ]
Schafft, HA [1 ]
机构
[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA
关键词
D O I
10.1016/S0026-2714(00)00227-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Improved values for the resistivity, rho, of pure, bulk copper from 50 to 1200 K, and their confidence intervals, are developed by extending the analysis of Matula. A recommended value for d rho /dT and its confidence interval in the temperature range of 290-425 K is developed for use with Matthiessen's rule to calculate the electrical thickness of thin copper films and the cross-sectional area of copper lines from resistance measurements at two temperatures. Error analyses are used to estimate the uncertainty with which the electrical thickness and cross-sectional area can be determined. Values for the temperature coefficient of resistance of pure, bulk copper are also provided. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:239 / 252
页数:14
相关论文
共 50 条
  • [1] ELECTRICAL-RESISTIVITY OF COPPER AND NICKEL THIN-FILM INTERCONNECTIONS
    JOHNSON, BC
    JOURNAL OF APPLIED PHYSICS, 1990, 67 (06) : 3018 - 3024
  • [2] AN EXPERIMENTAL DETERMINATION OF ELECTRICAL RESISTIVITY OF DISLOCATIONS IN COPPER
    RIDER, JG
    FOXON, CTB
    PHILOSOPHICAL MAGAZINE, 1967, 16 (144): : 1133 - &
  • [3] Effect of phase transitions in copper-germanium thin film alloys on their electrical resistivity
    Tawancy, HM
    Aboelfotoh, MO
    JOURNAL OF MATERIALS SCIENCE, 1995, 30 (23) : 6053 - 6064
  • [4] The Electrical Resistivity of Ultra-Thin Copper Films
    Schmiedl, Ernst
    Wissmann, Peter
    Finzel, Hans-Ulrich
    ZEITSCHRIFT FUR NATURFORSCHUNG SECTION A-A JOURNAL OF PHYSICAL SCIENCES, 2008, 63 (10-11): : 739 - 744
  • [5] A study of the electrical resistivity increase in narrow and thin copper interconnects
    Wada, M.
    Yamada, M.
    Higashi, K.
    Kajita, A.
    Shibata, H.
    ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007), 2008, 23 : 245 - 251
  • [6] CHANGE IN ELECTRICAL RESISTIVITY OF PURE COPPER SINGLE CRYSTALS AS A FUNCTION OF COLD WORK
    MICHENER, JW
    KOEHLER, JS
    PHYSICAL REVIEW, 1951, 81 (02): : 311 - 311
  • [7] Relation between the tensile strength and the electrical resistivity of commercially pure copper.
    Alkins, WE
    JOURNAL OF THE INSTITUTE OF METALS, 1924, 31 : 157 - 163
  • [8] EFFECT OF CRYSTAL-STRUCTURE ON THE ELECTRICAL-RESISTIVITY OF COPPER-GERMANIUM THIN-FILM ALLOYS
    ABOELFOTOH, MO
    TAWANCY, HM
    JOURNAL OF APPLIED PHYSICS, 1994, 75 (05) : 2441 - 2446
  • [9] Electrical resistivity calculations for copper nanointerconnect
    Zong, Zhaoxiang
    Mohammadzadeh, Saeideh
    Cao, Yongfeng
    Qiu, Zhijun
    Liu, Ran
    Streiter, Reinhard
    Gessner, Thomas
    MICROELECTRONIC ENGINEERING, 2010, 87 (03) : 402 - 405
  • [10] ELECTRICAL RESISTIVITY OF CYCLICALLY DEFORMED COPPER
    POLAK, J
    CZECHOSLOVAK JOURNAL OF PHYSICS, 1969, 19 (03) : 315 - &