Ultra-Fine Pitch Individually Addressable Visible Laser Arrays for High Speed Digital Printing Applications

被引:0
|
作者
Kowalski, O. P. [1 ]
McDougall, S. D. [1 ]
Qiu, B. C. [1 ]
Masterton, G. H. [1 ]
Armstrong, M. L. [1 ]
Robertson, S. [1 ]
Caldecott, S. [1 ]
Marsh, J. H. [1 ]
机构
[1] Intense Ltd, Glasgow G72 0BN, Lanark, Scotland
来源
NOVEL IN-PLANE SEMICONDUCTOR LASERS VIII | 2009年 / 7230卷
关键词
D O I
10.1117/12.809088
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
An individually addressable visible semiconductor laser diode array with a 20 mu m pitch is demonstrated that is highly suited for deployment in next-generation digital print systems. The array, operating at 660 nm, comprises 22 single mode lasers fabricated on a single GaInP/AlGaInP/GaAs substrate. The laser array is flip-chip bonded onto a patterned ceramic submount that enables the individual elements to be driven independently and is integrated into a 26-pin butterfly package. Arrays tested CW exhibit low threshold current (<20 mA per emitter), up to 50 mW output power per channel with a high slope efficiency (0.9 W/A) and a high characteristic temperature of over 100 K.
引用
收藏
页数:8
相关论文
共 50 条
  • [41] Ultra-fine grinding and mechanical activation of mine waste rock using a high-speed stirred mill for mineral carbonation
    Li, Jia-jie
    Hitch, Michael
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2015, 22 (10) : 1005 - 1016
  • [42] Wafer Level Underfill Study for High Density Ultra-fine Pitch Cu-Cu Bonding for 3D IC Stacking
    Xie, Ling
    Wickramanayaka, Sunil
    Jung, Boo Yung
    Li, Jerry Aw Jie
    Jung-Kai, Lim
    Ismael, Daniel
    2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 400 - 404
  • [43] Laser Metal Deposition of Ultra-Fine Duplex AlCrFe2Ni2-Based High-Entropy Alloy
    Molina, Veronica Rocio
    Weisheit, Andreas
    Gein, Sergej
    Hecht, Ulrike
    Vogiatzief, Dimitrios
    FRONTIERS IN MATERIALS, 2020, 7 (07):
  • [44] Novel monolayer-enhanced non-conductive film (NCF) for ultra-fine pitch high performance interconnect in lead-free electronics
    Li, Yi
    Yim, Myung Jin
    Wong, C. P.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1911 - +
  • [45] Caustics method combined with laser & digital high-speed camera and its applications
    Yang, L.-Y. (yangly@cumtb.edu.cn), 2013, China University of Mining and Technology (42):
  • [46] Ultra High Brightness Laser Diode Arrays for Pumping of Compact Solid State Lasers and Direct Applications
    Kohl, Andreas
    Fillardet, Thierry
    Laugustin, Arnaud
    Rabot, Olivier
    OPTICS AND PHOTONICS FOR COUNTERTERRORISM, CRIME FIGHTING, AND DEFENCE VIII, 2012, 8546
  • [47] FE-AL BASED COMPOSITE REINFORCED WITH ULTRA-FINE AL2O3 OXIDES FOR HIGH TEMPERATURE APPLICATIONS
    Kopec, Mateusz
    Jozwiak, Stanislaw
    Kowalewski, Zbigniew L.
    JOURNAL OF THEORETICAL AND APPLIED MECHANICS, 2021, 59 (03) : 509 - 513
  • [48] Fe-Al based composite reinforced with ultra-fine Al2O3oxides for high temperature applications
    Kopec, Mateusz
    Józwiak, Stanislaw
    Kowalewski, Zbigniew L.
    Journal of Theoretical and Applied Mechanics (Poland), 2021, 59 (03): : 509 - 513
  • [49] Ultra low-voltage differential static D flip-flop for high speed digital applications
    Berg, Yngvar
    International Journal of Circuits, Systems and Signal Processing, 2012, 6 (04): : 263 - 268
  • [50] A study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with self-exposed conductive particles surface for ultra-fine pitch Chip-on-Glass (COG) applications
    Yoon, Dal-Jin
    Paik, Kyung-Wook
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2266 - 2271