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- [12] Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, : 181 - 186
- [14] Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (01): : 129 - 136
- [15] Copper interconnections for high performance and fine pitch flipchip digital applications and ultra-miniaturized RF module applications 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 102 - +
- [16] High-speed friction and wear behavior of ultra-fine grain cemented carbide Mocaxue Xuebao, 2008, 1 (78-82):
- [17] Compaction of ultra-fine WC powder by high-speed centrifugal compaction process PROGRESS IN POWDER METALLURGY, PTS 1 AND 2, 2007, 534-536 : 249 - +
- [19] Study on Warpage and Stress of TSV Wafer with Ultra-Fine Pitch Vias for High Density Chip Stacking 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,