共 50 条
- [1] Individually addressable visible laser arrays for display and printing applications HIGH-POWER DIODE LASER TECHNOLOGY XIX, 2021, 11668
- [2] HIGH-POWER INDIVIDUALLY ADDRESSABLE VISIBLE AND MID-IR LASER ARRAYS FOR DISPLAY AND OTHER APPLICATIONS HIGH-POWER DIODE LASER TECHNOLOGY XX, 2022, 11983
- [3] Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology IEEE Trans. Electron. Packag. Manuf., 4 (303-307):
- [4] The Impact of Stencil Aperture Design for Next Generation Ultra-Fine Pitch Printing 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
- [5] Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 1999, : 100 - 105
- [6] Process Development of Ultra-Fine Pitch High Density Micro Bumps 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1500 - 1503
- [7] Ultra-Fine Via Pitch on Flexible Substrate for High Density Interconnect (HDI) 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 134 - 139
- [8] Particle on Bump (POB) technique for ultra-fine pitch chip on glass (COG) applications ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 77 - 80
- [9] AlGaInN laser diode bar and array technology for high power and individually addressable applications HIGH-POWER, HIGH-ENERGY, AND HIGH-INTENSITY LASER TECHNOLOGY II, 2015, 9513