Rapid annealing of the vacancy-oxygen center and the divacancy center by diffusing hydrogen in silicon

In hydrogenated high-purity Si, the vacancy-oxygen (VO) center is shown to anneal already at temperatures below 200 degrees C and is replaced by a center, identified as a vacancy-oxygen-hydrogen complex, with an energy level 0.37 eV below the conduction-band edge and a rather low thermal stability. At long annealing times, the process is reversed and the concentration of the latter defect is reduced, while the VO center partly recovers. The divacancy (V-2) center anneals in parallel with the initial annealing of the VO center, and the loss in V-2 exhibits a one-to-one proportionality with the appearance of a hole trap 0.23 eV above the valence-band edge attributed to a divacancy-hydrogen (V2H) center.