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- [4] Continuum Damage Evolution in Pb-Free Solder Joint under Shear Fatigue Loadings 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 304 - 308
- [5] Microstructure evolution in a Pb-free solder alloy during mechanical fatigue MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 431 (1-2): : 166 - 174
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- [7] Extended Cohesive Zone Model for Simulation of Solder/IMC Interface Cyclic Damage Process in Pb-free Solder Interconnects 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
- [9] Effect of Microstructure Evolution on Pb-free Solder Joint Reliability in Thermomechanical Fatigue 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 493 - 499
- [10] Microstructural evolution in Pb-free solder microjoints PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1075 - 1078