Partitioned cyclic fatigue damage evolution model for Pb-free solder materials

被引:0
|
作者
Ladani, Leila J. [1 ]
Dasgupta, A. [1 ]
机构
[1] Univ Maryland, Dept Mech Engn, CALCE Elect Prod & Syst Consortium, College Pk, MD 20742 USA
关键词
partitioned viscoplastic constitutive model; cyclic loading; energy partitioning fatigue model; partitioned damage evolution model; cyclic load-drop experiments;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
This study presents an approach to predict the degree of material degradation and the resulting changes in constitutive properties during cyclic loading in viscoplastic materials in micro-scale applications. The objective in the modeling approach is to address the initiation and growth of distributed micro-damage, in the form of micro-cracks and micro-voids, as a result of cyclic, plastic and creep deformations of material. This study extends an existing micromechanics-based approach, developed for unified viscoplastic models [Wen, et al, 20011, which uses dislocation mechanics to predict damage due to distributed micro-scale fatigue crack initiation [Mura and Nakasone, 1990]. In the present study, the approach is extended to a partitioned viscoplastic framework, because the micro-scale mechanisms of deformation and damage are different for plastic and creep deformation. In this approach, the model constants for estimating cyclic damage evolution are allowed to be different for creep and plastic deformations. A partitioned viscoplastic constitutive model is coupled with an energy partitioning (E-P) damage model [Oyan and Dasgupta, 1992] to assess fatigue damage evolution due to cyclic elastic, plastic and creep deformations. Wen's damage evolution model is extended to include damage evolution due to both plastic and creep deformations. The resulting progressive degradation of elastic, plastic and creep constitutive properties are continuously assessed and updated. The approach is implemented on a viscoplastic Pb-free solder. Dominant deformation modes in this material are dislocation slip for plasticity and diffusion-assisted dislocation climb/glide for creep. The material's behavior shows a good correlation with the proposed damage evolution model. Damage evolution constants for plastic and creep deformation were obtained for this Pb-free solder from load drop data collected from the mechanical cycling experiments at different temperatures. The amount of cyclic damage is evaluated and compared with experiment.
引用
收藏
页码:119 / 125
页数:7
相关论文
共 50 条
  • [1] A MECHANICAL FATIGUE DAMAGE EVOLUTION MODEL FOR PB-FREE SOLDER MATERIALS
    Ladani, Leila J.
    Razmi, Jafar
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 13, PTS A AND B, 2009, : 603 - 609
  • [2] An anisotropic mechanical fatigue damage evolution model for Pb-free solder materials
    Ladani, Leila J.
    Razmi, Jafar
    MECHANICS OF MATERIALS, 2009, 41 (07) : 878 - 885
  • [3] DAMAGE INITIATION AND PROPAGATION MODELING USING ENERGY PARTITIONING DAMAGE EVOLUTION MODEL FOR PB-FREE SOLDER MATERIALS
    Ladani, Leila J.
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [4] Continuum Damage Evolution in Pb-Free Solder Joint under Shear Fatigue Loadings
    Shaffiar, N. M.
    Loh, W. K.
    Kamsah, N.
    Tamin, M. N.
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 304 - 308
  • [5] Microstructure evolution in a Pb-free solder alloy during mechanical fatigue
    Matin, M. A.
    Vellinga, W. P.
    Geers, M. G. D.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 431 (1-2): : 166 - 174
  • [6] High cycle cyclic torsion fatigue of PBGA Pb-free solder joints
    Qi, Haiyu
    Zhang, Qian
    Tinsley, Edwin C.
    Osterman, Michael
    Pecht, Michael G.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (02): : 309 - 314
  • [7] Extended Cohesive Zone Model for Simulation of Solder/IMC Interface Cyclic Damage Process in Pb-free Solder Interconnects
    Yamin, A. F. M.
    Shaffiar, N. M.
    Loh, W. K.
    Tamin, M. N.
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [8] UCPD Model for Pb-Free Solder
    Neilsen, Michael K.
    Vianco, Paul T.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (04)
  • [9] Effect of Microstructure Evolution on Pb-free Solder Joint Reliability in Thermomechanical Fatigue
    Yin, Liang
    Meilunas, Michael
    Arfaei, Babak
    Wentlent, Luke
    Borgesen, Peter
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 493 - 499
  • [10] Microstructural evolution in Pb-free solder microjoints
    Morris, JW
    Song, HG
    Kim, YH
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1075 - 1078